Description
The new IBM Distributed Power Interconnect (DPI) is a cost-effective solution for xSeries customers looking for an efficient power distribution product for the rack environment. These Power Distribution Units (PDUs) provide excellent power availability with the following features:
– Connector linking components rather than country-specific hardwire line cords offer:
— Easier attachment of proper regional/country line cord
— Scalability; lets you choose products from 15Amps up to 60Amps
— Simplified installation in the rack
– DPI products extend and enhance availability with their:
— A modular approach to power distribution
— Ability to place 42 plus outlets into a rack without sacrificing valuable EIA space
— Line cord consolidation; reducing line cord saves time and cost
– Built on IBM Interconnect Rack Architecture, these products help improve the rack ecosystems with their design.
– Built on the principles of IBM Interconnect Rack Architecture
with:
— Speedy installation
— Simple cabling
— Money-saving design
— Improved management
– Customer-friendly alternatives to current PDUs
– Great worldwide coverage; many countries supported with DPI
– Competitive advantages include:
— Easy setup
— Fast installation
— Simple scalability
Feature |
Feature Value |
Connector 1 |
NEMA L6-30P |
Input current |
30 A |