HPE Intel Xeon E7-2860 processor 2.26 GHz 24
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HP DL980 G7 Intel Xeon E7-2860 (2.26GHz/ 10-core /24MB/130W) 4-processor Kit
Description
The Dual-Core Intel® Xeon® processor 7000 series is designed for high-performance multi-processor server applications for mid-tier enterprise serving and server consolidation. Based on the Intel NetBurst®
microarchitecture and the new Hyper-Threading Technology, it is binary compatible with pervious Intel
Architecture (IA-32) processors. The addition of Intel® 64 architecture provides 64-bit computing and 40-bit addressing provides up to 1 Terabyte of direct memory addressability. The Dual-Core Intel Xeon processor 7000 series is scalable to four processors and beyond in a multiprocessor system providing exceptional performance for applications running on advanced operating systems such as Microsoft Windows 2003 server, and Linux operating systems. The Intel Xeon processor 7000 series delivers compute power at unparalleled value and flexibility for internet infrastructure and departmental server applications, including application servers, databases, and business intelligence. The Inter NetBurst microarchitecture with Hyper-Threading Technology and Intel 64 architecture delivers outstanding performance and headroom from peak internet server workloads, resulting in faster response times, support for more users, and improved scalability.
Enhanced thermal and power management capabilities are implemented including Thermal
Monitor and Enhanced Intel SpeedStep® Technology. Thermal Monitor provides efficient and
effective cooling in high temperature situations. Enhanced Intel SpeedStep Technology allows
trade-offs to be made between performance and power consumption. This may lower average
power consumption (in conjunction with OS support).
The Dual-Core Intel Xeon processor 7000 series supports Hyper-Threading Technology
(HT Technology). This feature allows a single, physical processor to function as two logical
processors. While some execution resources such as caches, execution units, and buses are shared,
each logical processor has its own architectural state with its own set of general-purpose registers,
control registers to provide increased system responsiveness in multitasking environments, and
headroom for next generation multi-threaded applications.
Feature | Feature Value |
---|---|
Processor family | Intel® Xeon® E7 Family |
Processor cores | 10 |
Processor socket | LGA 1567 (Socket LS) |
Processor lithography | 32 nm |
Processor model | E7-2860 |
Processor base frequency | 2.26 GHz |
Processor operating modes | 64-bit |
Component for | Server/workstation |
Processor threads | 20 |
System bus rate | 6.4 GT/s |
Processor boost frequency | 2.666 GHz |
Processor cache | 24 MB |
Processor cache type | L3 |
Thermal Design Power (TDP) | 130 W |
Memory channels | Quad-channel |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 800,978,1066,1333 MHz |
ECC | Yes |
On-board graphics card | No |
Execute Disable Bit | Yes |
Thermal Monitoring Technologies | Yes |
Market segment | Server |
Scalability | S2S |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® Turbo Boost Technology | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Tcase | 69 °C |
Processor package size | 49.1 mm |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Additional information
Processor family | Intel® Xeon® E7 Family |
---|---|
Processor socket | LGA 1567 (Socket LS) |
Processor model | E7-2860 |
Processor operating modes | 64-bit |
Processor threads | 20 |
Processor boost frequency | 2.666 GHz |
Processor cache type | L3 |
Memory channels | Quad-channel |
ECC | Yes |
Execute Disable Bit | Yes |
Market segment | Server |
Tcase | 69 °C |
Processor cores | 10 |
Processor lithography | 32 nm |
Processor base frequency | 2.26 GHz |
Component for | Server/workstation |
System bus rate | 6.4 GT/s |
Processor cache | 24 MB |
Thermal Design Power (TDP) | 130 W |
On-board graphics card | No |
Scalability | S2S |
Processor package size | 49.1 mm |