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CPU Intel Xeon E-2226G/3.4 GHz/UP/LGA1151v2/T

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CM8068404174503
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CM8068404174503

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Description

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Platform Eligibility

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® TSX-NI

Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.


Feature Feature Value
Processor family Intel Xeon E
Processor cores 6
Processor socket LGA 1151 (Socket H4)
Processor lithography 14 nm
Box N
Cooler included N
Processor manufacturer Intel
Processor model E-2226G
Processor base frequency 3.4 GHz
Processor operating modes 64-bit
Component for Server/workstation
Processor threads 6
System bus rate 8 GT/s
Processor boost frequency 4.7 GHz
Processor cache 12 MB
Processor cache type Smart Cache
Thermal Design Power (TDP) 80 W
Processor codename Coffee Lake
Processor ARK ID 191038
Memory channels Dual-channel
Maximum internal memory supported by processor 128 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2666 MHz
ECC Y
On-board graphics card Y
Discrete graphics card N
On-board graphics card model Intel UHD Graphics P630
Discrete graphics card model Not available
Maximum on-board graphics card memory 128 GB
On-board graphics card base frequency 350 MHz
On-board graphics card dynamic frequency (max) 1200 MHz
Number of displays supported (on-board graphics) 3
On-board graphics card 4K support Y
On-board graphics card DirectX version 12.0
On-board graphics card OpenGL version 4.5
On-board graphics card maximum resolution (DisplayPort) 4096 x 2304 pixels
On-board graphics card maximum resolution (eDP – Integrated Flat Panel) 4096 x 2304 pixels
On-board graphics card maximum resolution (HDMI) 4096 x 2160 pixels
On-board graphics card refresh rate at maximum resolution (DisplayPort) 60 Hz
On-board graphics card refresh rate at maximum resolution (eDP – Integrated Flat Panel) 60 Hz
On-board graphics card refresh rate at maximum resolution (HDMI) 24 Hz
On-board graphics card ID 0x3E96
Execute Disable Bit Y
Idle States Y
Thermal Monitoring Technologies Y
Market segment Server
Maximum number of PCI Express lanes 16
PCI Express slots version 3.0
PCI Express configurations 1×16, 2×8, 1×8+2×4
Supported instruction sets SSE4.1, SSE4.2, AVX 2.0
Scalability 1S
CPU configuration (max) 1
Embedded options available N
PCI Express CEM revision 3.0
Harmonized System (HS) code 85423119
Export Control Classification Number (ECCN) 5A992C
Commodity Classification Automated Tracking System (CCATS) G077159
Intel® Hyper Threading Technology (Intel® HT Technology) N
Intel® Turbo Boost Technology 2.0
Intel® Quick Sync Video Technology Y
Intel® InTru™ 3D Technology Y
Intel® Clear Video HD Technology (Intel® CVT HD) Y
Intel® AES New Instructions (Intel® AES-NI) Y
Enhanced Intel SpeedStep Technology Y
Intel Trusted Execution Technology Y
Intel® Memory Protection Extensions (Intel® MPX) Y
Intel® Turbo Boost Technology 2.0 frequency 4.7 GHz
Intel® Transactional Synchronization Extensions Y
Intel VT-x with Extended Page Tables (EPT) Y
Intel® Secure Key Y
Intel TSX-NI Y
Intel® OS Guard Y
Intel Clear Video Technology Y
Intel Software Guard Extensions (Intel SGX) Y
Intel 64 Y
Intel Virtualization Technology (VT-x) Y
Intel Virtualization Technology for Directed I/O (VT-d) Y
Intel® Optane™ Memory Ready Y
Intel® Boot Guard Y
Intel® vPro™ Platform Eligibility Y
Tcase 73 °C
Tjunction 100 °C
Product type Processor
Supported memory types DDR4-SDRAM
Maximum graphics card memory 128 GB
Package width 70 mm
Package depth 116 mm
Package height 101 mm
Package weight 316 g
Package type Retail box
Processor package size 37.5mm x 37.5mm
Maximum internal memory 128 GB
Launch date Q2’19
Maximum resolution & refresh rate (DisplayPort) 4096×2304@60Hz
Status Launched
Maximum memory 128 GB
Bus speed 8 GT/s
Processor ID 0x3E96

Additional information

Processor family

Intel Xeon E

Processor manufacturer

Intel

Intel 64

Y

Intel® Boot Guard

Y

Thermal Design Power (TDP)

80 W

Execute Disable Bit

Y

PCI Express configurations

1×16, 2×8, 1×8+2×4

Component for

Server/workstation

Box

N

System bus rate

8 GT/s

Tcase

73 °C

Processor ARK ID

191038

Product type

Processor

Processor socket

LGA 1151 (Socket H4)

Status

Launched

On-board graphics card

Y

Processor base frequency

3.4 GHz

Embedded options available

N

Bus speed

8 GT/s

Intel TSX-NI

Y

Processor package size

37.5mm x 37.5mm

Package weight

316 g

Harmonized System (HS) code

85423119

Launch date

Q2'19

Scalability

1S

Package depth

116 mm

Processor cache

12 MB

Memory channels

Dual-channel

Intel® OS Guard

Y

Processor boost frequency

4.7 GHz

PCI Express CEM revision

3.0

CPU configuration (max)

1

Intel® Secure Key

Y

Supported instruction sets

SSE4.1, SSE4.2, AVX 2.0

Processor cache type

Smart Cache

Processor cores

6

Market segment

Server

Idle States

Y

PCI Express slots version

3.0

Discrete graphics card

N

On-board graphics card ID

0x3E96

ECC

Y

Cooler included

N

Processor threads

6

Processor codename

Coffee Lake

Package type

Retail box

Package height

101 mm

Processor model

E-2226G

Supported memory types

DDR4-SDRAM

Processor lithography

14 nm

Package width

70 mm

Maximum memory

128 GB

Tjunction

100 °C

Processor operating modes

64-bit

Maximum internal memory

128 GB

Processor ID

0x3E96

Brand

Intel