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Intel Server System M50FCP2UR312 Intel C741 LGA 4677 (S

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M50FCP2UR312
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£2,090.02
£2,508.02
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Description

Intel® Trusted Execution Technology
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Integrated Graphics
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Intel® Optane™ Memory Supported
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Advanced Management Technology
Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Total Memory Encryption
TME – Total Memory Encryption (TME) helps protect data against exposure via physical attack on memory, such as cold-boot attacks.

Max # of UPI Links
Intel® Ultra Path Interconnect (UPI) links are a high speed, point-to-point interconnect bus between the processors, delivering increased bandwidth and performance over Intel® QPI.

Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Optane™ Persistent Memory Supported
Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.


Feature Feature Value
Built-in processor No
Motherboard chipset Intel C741
Processor socket LGA 4677 (Socket E)
Number of processors supported 2
Processor manufacturer Intel
Compatible processor series Intel® Xeon®
Number of DIMM slots 32
Supported memory types DDR5-SDRAM
Maximum internal memory 12 TB
Number of storage drives supported 12
Hot-swap HDD bays Yes
Number of 3.5″ bays 12
Storage drive sizes supported 3.5″
Supported storage drive types HDD & SSD
RAID levels 0, 1, 5, 10
USB 2.0 ports quantity 3
USB ports quantity 5
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 2
Serial ports quantity 1
Number of SATA connectors 10
PCI Express slots version 5.0
Integrated BMC with IPMI Yes
Trusted Platform Module (TPM) Yes
Trusted Platform Module (TPM) version 2.0
Intel® Optane™ DC Persistent Memory Supported Yes
Backplanes support Yes
Export Control Classification Number (ECCN) 5A002U
Commodity Classification Automated Tracking System (CCATS) G157815L1
ARK ID 229746
Harmonized System (HS) code 8473305100
Intel Advanced Management Technology Yes
Intel Remote Management Module Support Y
Intel Intelligent Power Node Manager Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Optane™ Memory Ready Yes
Chassis type Rack (2U)
Rack rails No
Rack-Friendly board Yes
Redundant fans support Yes
Heat sink included Yes
Power supply 2100 W
Power supply type AC
Redundant power supply (RPS) support Yes
Thermal Design Power (TDP) 250 W
Width 770 mm
Depth 438 mm
Height 87 mm
CPU configuration (max) 2
On-board graphics card No
Intel Node Manager Yes
Number of UPI links 3
Extended warranty available for purchase (select countries) Yes
Launch date Q1’23
Riser slot 1 number of lanes 32
Riser slot 2 number of lanes 32
Status Launched
Supported RAID configuration 0/1/5/10
Supported board Intel Server Board M50FCP2SBSTD
Target market Mainstream
Riser slot 3 number of lanes 16

Additional information

Built-in processor

No

Processor socket

LGA 4677 (Socket E)

Processor manufacturer

Intel

Number of DIMM slots

32

Maximum internal memory

12 TB

Hot-swap HDD bays

Yes

RAID levels

0, 1, 5, 10

USB ports quantity

5

Serial ports quantity

1

PCI Express slots version

5.0

ARK ID

229746

Rack rails

No

Redundant fans support

Yes

Power supply

2100 W

Width

770 mm

Height

87 mm

On-board graphics card

No

Launch date

Q1'23

Target market

Mainstream

Motherboard chipset

Intel C741

Compatible processor series

Intel® Xeon®

Supported memory types

DDR5-SDRAM

Number of 3.5" bays

12

USB 2.0 ports quantity

3

Number of SATA connectors

10

Integrated BMC with IPMI

Yes

Backplanes support

Yes

Harmonized System (HS) code

8473305100

Chassis type

Rack (2U)

Rack-Friendly board

Yes

Heat sink included

Yes

Power supply type

AC

Thermal Design Power (TDP)

250 W

Depth

438 mm

CPU configuration (max)

2

Intel Node Manager

Yes

Status

Launched

Supported board

Intel Server Board M50FCP2SBSTD